Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness.
Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work.
Driving New Product Introduction process through NPI Phase Gate Review.
Coordinating new product start-upto achieve first pass qualification.
Understand new product start-up datelines, productapplicationsand customer requirements; and communicate this information to the new product start-up team
Working with process / equipment / manufacturing / planning area owners to bring newproductandpackageinto volume production.
Providingtimelysupport of First silicon, Engineering samples, Qualsamplesand meetingexpectationon Engineering Hotlotscycle time as perProduct Development Team (PDT)schedule.
Regular monitoring the product yieldtrend;Quality Deviation Record (QDR)and reliability to ensure that assembly operation is in control andinitiateearly attention if necessary.
DriveElectricalFailure Analysis (EFA)/ PhysicalFailureAnalysis(PFA)closure for NPI issues, including:
Assembly failures (crack, delamination, shorts, opens, warpage)
Testfailures
Reliability failures
Owning the entire Product Life Cycle, from NPI toEnd of Life (EOL).
Understanding new product challenges andcollaborating with Process / Equipment/Development owners to developnew technologycapabilities ahead of market
Act as the technical integrator across multiple manufacturing sites and partners(Design,NPI, Site Process & Equipment, Package Reliability, Test, Quality)
Acting as a point of contacttoTechnical Program Manager (TPM)on product related matters.
Minimum Required Qualifications/Experience
Education
MinimumBachelor's degree in Mechanical, Materials, Aerospace, Chemical, Electrical, Process,Semiconductoror related Engineering discipline
Experience
Freshgraduatewithstrong passion insemiconductor engineeringisencouragedto apply.
Technical Skills
Strong understanding of:
Advanced package assembly flowsand able to understand design geometry
VariousDie stacking, thin substrates,mold compound, warpage, and mechanical reliability
NPI qualification frameworks (Qual, Low Volume Manufacturing,Post ReleaseQualification)
Handson experience with:
Yield analysis, statistical data interpretation
Failure analysis methodologies
Process characterization and validation
Familiarity with:
Phase Gate / NPI/Technology Development (TD)business processes
Crosssite manufacturing transfers
Soft Skills & Leadership Attributes
Strong ownership mindset withabilityto lead without authority.
Thrive inworking in afast-evolvingNPI environment
Able to balance technical depth with execution speed
Strong analytical, logical, and critical thinking skills
Effective communicator, able to collaborate across all levels
Growth mindset with a passion for continuous learning
Internship or experience in the semiconductor industry is a plus
Demonstrated leadership anda track recordof impact are highly desirable
Interest in and knowledge of the semiconductor industry and Micron is preferred
Ability to apply baseline digital fluency and roleappropriate AIliteracy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problemsolving, operational tasks, and a
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