RDA Application Engineer

工作職責（RESPONSIBILITIES） 

• 開發、優化及維護晶圓製造製程，以提升良率、品質、成本效益與生產效率。

• 推動單站點（Process Step）製程改善與評估。

• 主導產線持續改善專案。

• 運用結構系統化方法（FMEA、8D、SPC、FDC）分析良率與缺陷問題。

• 診斷根本原因，並將生產停機時間降至最低。

• 運用資料分析預防問題反覆發生。

• 運用SPC、FDC與APC追蹤製程表現並偵測製程偏移異常趨勢。

• 管理製程驗證與製程控制計畫。

• 確保生產週期、產能與產品品質。

• 驗證新世代製程技術導入的準備狀況

• 解決量產擴充階段的技術挑戰

• 達成新產品導入及產能提升期間的生產目標

• 與設備、整合、製造及品質團隊合作。

• 解決影響良率、產能與品質的相關問題。

• 向利害關係人溝通技術發現與改善建議。

• Develop,optimize, and sustain wafer fabrication processes to improve yield, quality, cost efficiency, and manufacturing productivity.

• Drive process-step improvement initiatives and process evaluations.

• Lead continuous improvement projects within the manufacturing environment.

• Apply structured problem-solving methodologies, including FMEA, 8D, SPC, and FDC, to analyze yield excursions and defect-related issues.

• Diagnose root causes and minimize production downtime.

• Leverage data analysis to prevent recurring issues and improve process stability.

• Monitor process performance andidentifyprocess drift or abnormal trends using SPC, FDC, and APC.

• Manage process qualification activities and process control plans.

• Ensure cycle time, production capacity, and product qualityobjectivesare achieved.

• Validate readiness for the introduction of next-generation process technologies.

• Resolve technical challenges associated with high-volume manufacturingrampand production scaling.

• Achieve manufacturing targets during new product introduction (NPI) and capacity expansion phases.

• Collaborate closely with Equipment, Integration, Manufacturing, and Quality teams.

• Resolve issuesimpactingyield, throughput, and product quality.

• Communicate technical findings, analyses, and improvement recommendations to stakeholders.

基本要求（MINIMUM REQUIREMENTS）

• 具相關技術領域之學士學位以上、進階專業證照、同等技術軍職經驗，或其他足以展現相關能力與專業經驗的同等資格。

• 優先考量科系:化學工程,電機工程, 材料科學,化學,物理,機械工程, 工業工程

• 在需要時穿戴個人防護裝備（PPE）與無塵室服裝

Minimum Qualifications

• Bachelor's degree or higher in a relevant technical discipline, advanced professional certification, equivalent military technical experience, or an equivalent combination of education, skills, and professional experiencedemonstratingthe required competencies.

• Preferred Majors: Chemical Engineering, Electrical Engineering, Materials Science, Chemistry, Physics, Mechanical Engineering, Industrial Engineering, or related technical disciplines.

• Willing and able to wearrequiredPersonal Protective Equipment (PPE) and cleanroom attire as necessary in a semiconductor manufacturing environment.

基本資格條件（MINIMUM QUALIFICATIONS）

可透過學歷、實習、研究、軍事技術訓練、製造或專業經驗展現

• 半導體製程開發

• 製程流程與配方(Recipe)管理

• 統計製程管制（SPC）與故障偵測與分類（FDC）

• 根本原因分析（RCA）失效模式與效應分析（FMEA）、8D問題解決方法

• 製程及設備特性理解

• 資料分析與判讀

• 持續改善能力

• 技術文件撰寫能力

• 協作與團隊合作

• 學習敏捷度與適應力

• 主動積極與當責